📋 Description

• Own end-to-end root cause failure analysis investigations on microelectronics failing in
• Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF
• Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related
• Apply physics-of-failure principles and deep knowledge of semiconductor failure modes
• Drive corrective actions by working directly with silicon design, packaging, and manufacturing
• Author detailed technical reports documenting failure modes, root cause conclusions, supporting

🎯 Requirements

• Bachelor's degree in materials science, electrical engineering, physics, chemical engineering, or
• 5+ years of hands-on experience in microelectronics failure analysis or materials characterization